Bake and dry and dry packing of components

 

bake and drydry-packing    

We temper moisture-sensitive SMD components according to standard IPC/JEDEC J-STD-033A and customer instructions respectively. Finally the baked parts will be packed into moisture barrier bags together with a humidity detector and a desiccant bag. If requested a nitrogen filling could be added.

 

 

 

 

 

 

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