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Back & dry



Back & dry

We temper moisture-sensitive SMD components according to standard IPC/JEDEC J-STD-033A and customer instructions respectively. Finally the baked parts will be packed into moisture barrier bags together with a humidity detector and a desiccant bag. If requested a nitrogen filling could be added.

dry packing of components

Increasing miniaturization technologies and the characteristics, that used plastics of IC packages absorbes moisture, leads to problems during soldering process, arising of microcracking or pop up of IC packages
In order to prevent such issues, those kind of components will be baked and dryed and Dry-Pack packaged before delivery. In case that these packages are damaged or these kind of parts will be stored too long outside of this moisture sensitive package, they have to be re-baked again.