For SMD-taping we are using – depending on order quantity – automatic and/or manual taping machines. Tape widths can be processed in the range from 8 mm to 120 mm. This range will be extended in the future. Within this blister tape ranges we are able to provide taping service for really all types of components.
We also can quote the blister tape development and supply for new introductory components. Our equipment is able to process hot sealing cover tapes as well as pressure sealing (“cold sealing") cover tapes. Electrostatic sensitive components are delivered in a conductive packing foil bag.
We also can bake and dry the components and pack them into vacuum aluminium foil bags. Our taping processes are fully qualified in accordance to the international taping DIN EN 60286-3 standards.
- SO / SOIC / SOJ / SOMC / SOP / SOT / SSOP connections 8 – 64
- TSOP / TSSOP / VSO connections 8 – 64
- PLCC20 – 84
- QFP 05 x 05 – 28 x 28
- D – PAK / D2 – PAK
- BGA, QFN, DFN
- Ceramic Chip Capacitors
- Melf / Mini-Melf – Resistors – Diodes
- Tape & reel of bondpads
- Other Blister Taping: 8 mm – 120 mm tape width
- Special Taping upon request
- SO / SOIC / SOJ / SOMC / SOP / SOT / SSOP
- SOT 23
- ceramic capacitors
- all kind of IC´s
- power strips
- bondpads incl. blanking
- blanking components
- contact springs
- solder bushes